Technology
Leading the revolution
DeepStream has created an innovative digital sensor technology wrapped up in robust 3D packaging; overcoming physical barriers to embedding intelligence wherever it’s needed.
Technology
Combining two technologies; 3D packaging and digital sensors - supported by a state of the art manufacturing process - DeepStream can provide manufacturers a new technology to install radical new features in industrial, office and consumer products and overcome constraints suffered by traditional 2D substrates.
To measure energy use, to a point granular enough in the system to determine where it is being used, (or wasted); energy measurement solutions need installing at circuit, socket and appliance levels. In effect, this means placing them into electrical products themselves.
Until now, the technology has not been available to measure energy at this level. Traditional Printed Circuit Boards (PCBs) are restricted by their 2D nature, topology and their lack of resistance to hostile and hazardous environments inherent in products such as circuit breakers, sockets and appliances.
The result is that manufacturers are restricted in the development of products and the deployment of embedded intelligence. Recognising this, DeepStream has developed a unique combination of technologies that takes digital sensor intelligence to the next level integrating electro-mechanical and electronic components for the first time, and providing a host of innovative new features and intelligence.
For more information on our technology please visit our media centre to view our new Technology white paper and case study, or call Rob Furness on 01248 365600 or email enquiries@deepstream.com
PCB Vs 3D
Traditional PCBs have fulfilled a number of functions in electrical devices for many years. However, when it comes to embedding intelligence into awkwardly shaped products, they are found wanting in a number of ways.
- Size. PCBs can only be extended in two dimensions; it restricts applications with sufficient 2D plains where they can be applied.
- Topology. Traditional PCBs do not have a flexible topology; so any new features have to fit into existing 2D plains or else the product needs to be redesigned.
- Frailty. PCBs cannot be used in hostile environments such as in contact with arduous electrical, heat, and water. This lack of robustness means they have to be placed away from the areas where sensor information is most often needed.
The result is that manufacturers are restricted in the development of products and the deployment of embedded intelligence. A new technology is readily available that could add value to existing products and create additional revenue streams – DeepStream’s 3D shaped-circuits.