Technology
3D Shaped-Circuit
3D shaped-circuits use a unique multi-layer 3D packaging, which delivers robust, high-density electronic modules.
Shaped-Circuit
DeepStream has extended traditional over-moulded lead frame technology similar to that used in automotive applications. It features unique, multi-layer 3D packaging, which delivers robust, high-density electronic modules.
While traditional two-dimensional PCBs use a thin layer of foil laid on the surface of a flat substrate, DeepStream take a different approach; starting with a metal foil –itself thicker than is possible on a PCB; the circuit traces are stamped or etched out then ‘sandwiched’ within a mould plastic component.
The benefit of this technology is that several circuits can be layered on top of each other, providing an extraordinary number of functions in a small area. To provide the same result, traditional 2D PCBs would have to be placed side by side over a much larger footprint.
DeepStream’s 3D circuits are moulded inside robust plastic and the components mounted on the circuit are encapsulated. This means the entire module can withstand hostile environments such as high levels of electrical discharge and short circuit, heat and even water.
The module itself can also become a mechanical part of the container product, such as an insulator or part of the arc chamber, where it can even withstand arcing values greater than 10,000 amps. This creates opportunities to embed digital metering into products such as circuit breakers, contactors and sockets where previous it has not been possible.
For more information on DeepStream’s technology please visit our media centre to view our new Technology white papers and case study, or call Rob Furness on 01248 365600 or email enquiries@deepstream.com
Key Advantages
Better thermal management
By using thicker traces heat can be dispersed more effectively and the circuit itself can be used as a heat sink.
High current carrying capability
Using the thicker traces of the lead frame, the modules have higher current carrying capabilities with greater scope for heavy load applications.
3D shape
Instead of being flat and planar, the modules can be moulded into any imaginable shape and embedded in the most awkward spaces.
Simpler retrofit
A small footprint means the modules can be fitted in the same space as an existing PCB, yet integrate many more features.
Cost efficiency
Connectors and switches, which would normally be added on to the PCB, can be moulded into the plastic, reducing cost. The module becomes an electromechanical component replacing many costly mechanical elements.
Exceptionally durable
Special, high durability plastic is used, which is capable of withstand soldering temperatures. It is hermetically sealed, making it acid proof and waterproof, enabling integration into hostile environments with high power capabilities in low voltage applications.